Investing in Thintronics

Aug 5, 2024

TGVP, a TOPPAN company, has invested in Thintronics

TGVP is pleased to announce an investment in Thintronics, a Berkeley, California-based company specializing in the manufacture of next-generation insulating films. Their insulating film delivers superior electrical properties (low Dk, Df) compared to existing materials, which dramatically reduce energy loss in high-speed signal transmission on Printed Circuit Boards (“PCBs”) and chip packaging (“Packaging”).

PCBs connect chips with other chips/components on a circuit board and Packaging such as FCBGA (Flip Chip-Ball Grid Array) packaging is an advanced method to connect the input/output signals of a semiconductor die to a package carrier that are used to connect the die externally. These assemblies are typically laminated structures consisting of thermocompression insulating layers and patterned wiring through plating and etching processes to achieve the desired connectivity and compatibility with electrical components. As fundamental components of hardware development, the demand for PCBs and Packaging is expected to grow with the increasing adoption of IoT automation, edge computing, and especially, AI solutions.

Three common technical challenges are associated with PCB and Packaging: electrical loss, destruction of copper-filled vias, and warping of the substrate. Thintronics' materials address these issues effectively. Their films, characterized by low Dk and Df, significantly improve electrical performance, thereby reducing power consumption and minimizing environmental impact through decreased carbon dioxide emissions.

Regarding the mechanical properties issues—destruction of copper-filled vias and substrate warping—Thintronics' approach is fundamentally different from traditional materials. While conventional materials are hard, possess a low CTE (Coefficient of Thermal Expansion), and a high Tg (glass transition temperature), Thintronics aims for a softer, solid material using heat-curing resins. Their concept involves a very low modulus material with a low Tg, ensuring that the insulator is flexible enough to accommodate changes in the substrate and copper, thus preventing vias destruction and warping.

Historically, typical epoxy resins were designed with a high Tg and a low CTE, but the stress caused by the CTE mismatch with copper remained problematic, and further improvements in Dk and Df were unattainable. Thintronics distinguishes itself through innovative material formulation and resin synthesis, achieving outstanding electronic and mechanical properties. They also hold intellectual property rights on this concept to prevent competitors from replicating their material design.

TOPPAN's semiconductor back-end business has the potential to unlock and expand the value of Thintronics. As this collaboration comes to fruition, it is expected to revolutionize the packaging market.

 

About TGVP

TGVP is the US Corporate Venture Capital arm of TOPPAN, Inc.  Founded in 2022, the San Mateo based firm is focused on venture capital investments in US startup companies in Sustainability and Digital Transformation.  For more information, please visit, www.tgvp.vc

 

About TOPPAN

Established in Tokyo in 1900, TOPPAN is a leading and diversified global provider committed to delivering sustainable, integrated solutions in fields including printing, communications, security, packaging, décor materials, electronics, and digital transformation. TOPPAN’s global team of more than 50,000 employees offers optimal solutions enabled by industry-leading expertise and technologies to address the diverse challenges of every business sector and society and contribute to the achievement of shared sustainability goals.

About Thintronics

Thintronics Inc. is a California-based electronic materials startup supplying high-performance insulators for emerging AI datacenter, networking, and RF/millimeter-wave (mmW) applications. Founded in 2019 they have developed a suite of materials that display electrical and mechanical characteristic that far outpace the state of the art. For more information visit https://thintronics.com/